SACMN vs SAC305: Full Comparison

SACMN (Sn-Ag-Cu-Mn) is a manganese-doped micro-alloyed solder paste developed on the SAC305 base. It delivers drop shock and thermal fatigue reliability exceeding both SAC305 and SnPb, with a fully compatible reflow profile.

PropertySACMNSAC305
Drop Shock (JESD22-B111)SuperiorBaseline
Thermal FatigueSuperiorBaseline
IMC StabilityMn suppresses IMC growthStandard
Reflow CompatibilityFully compatibleBaseline
CostLower (low-Ag)Higher (3% Ag)
Automotive CertificationIATF16949Varies