Home › Products › SACMN High-Reliability Solder Paste

SACMN High-Reliability Solder Paste

Model: SP601+T4V1.1 / SACMN / T4

SACMN High-Reliability Solder Paste

SACMN manganese-alloy solder paste directly replacing SAC305 with superior drop shock and thermal fatigue reliability. Reflow-profile compatible — zero process changes required.

Technical Specifications

Core Product · SAC305 Replacement

Model SP601+T4V1.1 / SACMN / T4
Alloy SACM (Sn-Ag-Cu-Mn)
Melting Point 217-226°C
Metal Content 88.25±1%
Powder Size 20-38μm (Type 4)
Viscosity 180±30 Pa·S
Flux System No-Clean · Halogen-Free · Low-Void
Certifications RoHS / REACH / IATF16949
Applications Automotive, energy storage, aerospace high-reliability

Key Features

Direct replacement for SAC305, compatible reflow profile

Drop test performance exceeds SnPb and SAC305 (JESD22-B111)

Thermal fatigue resistance exceeds SAC305 and SnPb, stable IMC

Ideal for automotive, energy storage, aerospace applications

Significant cost advantage with performance exceeding SAC305

TECHNICAL DATA SHEET

Complete Technical Data

Printing Parameters

Print Speed 25~100 mm/s
Squeegee Pressure 0.020~0.027 kg/mm blade
Solder Paste Roll 20~25 mm
Stencil Life >8 hours (22~28°C / 30~60%RH)
Cleaning Frequency Every 10~25 boards

Storage & Handling

Storage Temp 0~10°C (Refrigerated)
Shelf Life 6 months refrigerated / 1 month room temp
Pre-use Warm-up ≥4 hours (to room temp)
Mixing Time Manual 2~4 min / Machine 1~2 min
Precautions Do not freeze · Do not mix old & new paste

Environmental Compliance

Flux Type ROL0 (IPC J-STD-004B)
Halogen Content None added (EN 14582)
RoHS 2011/65/EU Compliant
REACH SVHC List Compliant

Reliability Tests

Surface Insulation Resistance PASS (IPC J-STD-004B)
Solder Ball Test Acceptable
Slump Test PASS (IPC J-STD-005A)
Spreadability PASS (JIS Z 3197)

Packaging

Standard (500±2) g/jar
Custom Syringe dispensing / other specs upon request
Alloy Customization Other alloys & powder sizes (T3~T5) available

Recommended Reflow Profile

Peak Temperature 235~250°C (SAC Alloy)
Zone Profile Preheat 150~200°C · Soak 200~217°C · Above liquidus 30~60s · Cooling 2~4°C/s
Ramp Rate 1~2°C/s
Cooling Rate 2~4°C/s
Delta-T Control ΔT ≤ ±5°C

Related Products

Explore more solder paste products

SAC305 Low-Void Solder Paste

SAC305 Low-Void Solder Paste

Low Void · Universal

 Water-Washable Lead-Free Solder Paste

Water-Washable Lead-Free Solder Paste

Water-Washable Clean

 SAC105 Lead-Free Solder Paste

SAC105 Lead-Free Solder Paste

Ultra-Low-Silver Economy